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BGA Reliability and Manufacturing Challenges
11:00 am
BGA Reliability and Manufacturing Challenges
@ Webinar
Feb 8 @ 11:00 am – 12:00 pm
IEEE Boston/Providence/New Hampshire Reliability Chapter Please visit www.ieee.org/bostonrel FREE Webinar The reliability and manufacturability of BGA devices is becoming more dependent on the PCB structure, layout and chassis design. With every increasing part densities the chassis design (PCB mounting), board layout, and underfills can cause additional stresses to be applied …
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